Modular camera system and a method of manufacturing the same
US8488056B2 · kind B2 · utility
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26Claims
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Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
Abstract
A camera module includes a substrate with a cavity therein. A processor is located in the cavity, and wire bonding is for connecting the processor to the substrate. An imaging module is adapted to overlay the processor in the cavity and rest on at least part of the edge of the cavity. Wire bonding is for connecting the imaging module to the substrate and the processor. The cavity includes a longitudinal cutout section adapted to accommodate at least some wire bonding for connecting the processor to the substrate or associated surface mount components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.