Scalable interconnect modules with flexible channel bonding
US8488623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Apr 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2213/13322
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present application discloses apparatus and methods for increasing channel utilization for a high-speed serial interface of an integrated circuit (IC). A new circuit architecture is disclosed which provides circuitry that may be programmed flexibly to support a multitude of different channel bonding schemes. In accordance with one aspect of the invention, the new architecture decouples the granularity of control-signal channel bonding from the granularity of data-aggregation channel bonding. This advantageously allows optimization of configurations for both types of channel bonding. In another aspect of the invention, the logical boundaries of bonded user channels are decoupled from the physical boundaries of the PCS modules. This decoupling advantageously eliminates a rigid constraint of previous architectures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.