Micro via adapter socket
US8491315B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Nov 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micro via adapter socket (12) is provided by a printed circuit board (30) having an upper layer (32), a lower layer (40) and intermediate interconnect layers (34, 36 and 38). The lower layer (32) has an array of mini vias (60) formed therein for receiving respective ones of mini-springs (62). A top plate (42) is secured above the upper layer (32). The top plate (42) has a plurality of micro-pin recesses (54) spaced apart for registering with respective ones of the micro vias (48) and receiving micro-pins (52). A bottom plate (44) is secured beneath the lower layer (40). The bottom plate (44) has a plurality of mini-pin recesses (66) for removably receiving respective ones of the mini-pins (64). The intermediate interconnect layers (34, 36 and 38) have conductive tracks (76) which electrically connect between the micro vias (48) and the mini vias (60).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.