Patent · US Active

Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface

US8491713B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Jürgen Barthelmes · Berlin, DE
Robert Ruether · Oranienburg, DE
Olaf Kurtz · Berlin, DE
Jana BREITFELDER · Berlin, DE

Key dates

Filing date	Jan 13, 2010
Grant date	Jul 23, 2013
Priority date	—
Expiry date	Jul 13, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31678
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.