Whisker free tin plated layer
US8491774B2 · kind B2 · utility
1Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Mar 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12722
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.