Laminate type ceramic electronic component and method for manufacturing same
US8491834B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Mar 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.