Panel module and manufacturing method thereof
US8491986B2 · kind B2 · utility
0Cited by
1References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Sep 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A panel module is provided, including a first substrate, a second substrate, a first optical glue, and a second optical glue. The first and second optical glues are disposed between the first and second substrates, wherein the first optical glue protrudes from the first substrate, and the second optical glue adheres the first substrate to the second substrate. Specifically, the viscosity of the second optical glue is smaller than the first optical glue before solidification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.