System and method for aligning surface mount devices on a substrate
US8492175B1 · kind B1 · utility
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Inventor
Key dates
| Filing date | Nov 28, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Jan 31, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2635
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is provided for assembling a stack of surface-mount devices (SMDs) on a substrate. The method provides a substrate, die, or printed circuit board (PCB) with a top surface having a landing pad and a first reference feature. An alignment jig is placed overlying the substrate top surface. The alignment jig second reference feature is aligned with respect to the substrate first reference feature. A first SMD is placed overlying the substrate landing pad. The first SMD third reference feature is aligned with respect to the alignment jig second reference feature. A second SMD is placed overlying the substrate top surface. Then, the alignment jig first boundary feature is mated with the second SMD second boundary feature. In response to the mating, the second SMD first interface is aligned over an underlying SMD active element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.