Method of mounting a LED module to a heat sink
US8492179B2 · kind B2 · utility
0Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2009 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Jun 29, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.