Solar-cell marking method and solar cell

US8492240B2 · kind B2 · utility

Assignee

• HANWHA Q CELLS GMBH · DE

Inventors

• Joerg Mueller · Bonn, DE
• Toralf Patzlaff · Bodenwerder, DE

Key dates

• Filing date: Feb 28, 2007
• Grant date: Jul 23, 2013
• Expiry date: Oct 21, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a solar-cell marking method comprising the steps of: providing a substrate with a substrate surface for producing a solar cell (1) that comprises an active zone (5); and producing at least one indentation (21, 31) in the substrate surface with the use of laser irradiation, wherein the at least one indentation (21, 31) forms a marking (2, 3) for marking the solar cell (1), and producing the indentation (21, 31) is carried out prior to carrying out a solar-cell manufacturing process or during carrying out a solar-cell manufacturing process. According to the invention the substrate is designed as a semiconductor wafer with a wafer surface, and the marking (2, 3) is positioned on the wafer surface such that the marking (2, 3) is in the active zone (5) of the solar cell (1) formed by the semiconductor wafer. Furthermore, the invention relates to a semiconductor-wafer solar cell (1) whose marking is easily recognizable and thus positioned so as to be reliably readable, without this impeding the functionality of the solar cell (1).