Patent · US Active

3D integrated circuit with logic

US8492886B2 · kind B2 · utility

104Cited by

320References

26Claims

0Family size

Assignee

Monolithic 3D Inc. · US

Inventors

Zvi Or-Bach · San Jose, US
Ze'ev Wurman · Palo Alto, US

Key dates

Filing date	Nov 22, 2010
Grant date	Jul 23, 2013
Priority date	—
Expiry date	Mar 19, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit including a first layer of logic circuits, and a second layer of logic circuits overlaying the first layer, wherein the first layer includes a multiplicity of flip-flops wherein each of the flip-flops has at least one connection to the second layer, and wherein the second layer includes at least one logic circuit with inputs including the connection and with at least one output connected to the first layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.