Heat pump module and drying apparatus using the same
US8495822B2 · kind B2 · utility
6Cited by
50References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2010 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2031 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06F58/206
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A heat pump module and a drying apparatus having the same are provided. The heat pump module may include a housing, an evaporator provided in the housing that condenses humid air introduced into the housing via evaporation of a refrigerant, a condenser provided in the housing that heats the air having passed through the evaporator via condensation of the refrigerant, and at least one condensed water guide or remover provided in the housing that removes condensed water generated on a surface of the evaporator therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.