Method and apparatus for packaging surface acoustic wave transponder for down-hole applications
US8496184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2011 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Jul 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q13/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for packaging a surface acoustic wave transponder for use in harsh environments is provided. An exemplary transponder comprises a surface acoustic wave piezoelectric device, wire bonds, an antenna element, an antenna substrate, a dome structure, and casing. The exemplary surface acoustic wave piezoelectric device is attached directly onto the antenna substrate and wire bonded to an antenna element. The surface acoustic wave piezoelectric device is protected under the dome structure, which is sealed and attached to the antenna substrate. The components are encased and sealed within a transponder casing. The transponder may be part of or incorporated into substantially any shape or form factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.