Anodic bonding method, anodic bonding jig and anodic bonding apparatus
US8496767B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 5, 2011 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Aug 5, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C27/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step in which the base and the anodic bonding jig are pressurized in the direction to move the base and the anodic bonding jig close to each other, and the first substrate and the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.