Polyimide, polyamic acid and processes for the production thereof
US8497025B2 · kind B2 · utility
1Cited by
12References
11Claims
0Family size
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Key dates
| Filing date | May 13, 2009 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.