Micromechanical component
US8497216B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 20, 2011 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Jun 14, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0264
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method is described for manufacturing a micromechanical component. The method includes providing a first substrate, forming a first connecting structure on the first substrate, and forming a microstructure on the first substrate after forming the first connecting structure. The microstructure has at least one movable functional element. The method further includes providing a second substrate having a second connecting structure, and joining the first and second substrates by carrying out a bonding process, the first and second connecting structures being joined to form a common connecting structure, and a sealed cavity being formed in the region of the microstructure. The method provides that the first connecting structure takes the form of a buried connecting structure extending up to an upper surface of the first substrate. Also described is a related micromechanical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.