Dual-facing camera assembly

US8497536B2 · kind B2 · utility

Assignee

• OmniVision Technologies, Inc. · US

Inventors

• Gang Chen · San Jose, US
• Ashish Shah · Milpitas, US
• Duli Mao · Sunnyvale, US
• Hsin-Chih Tai · San Jose, US
• Howard E. Rhodes · Boise, US

Key dates

• Filing date: Sep 16, 2011
• Grant date: Jul 30, 2013
• Expiry date: Nov 22, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/811

Abstract

Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate).In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.