Remote high-performance modeling system for material joining and material forming
US8498728B2 · kind B2 · utility
4Cited by
4References
17Claims
0Family size
Inventors
Key dates
| Filing date | Oct 2, 2012 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Oct 2, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method for creating computerized models of forming processes, wherein forming process parameters including material type, material geometry, forming method, incoming material properties, forming die geometry, forming die thermal management method, lubrication method, forming rate, material constraint conditions, incoming material temperature, and other possible parameters are preselected by a user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.