Joint-aware manipulation of deformable models
US8498846B2 · kind B2 · utility
2Cited by
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21Claims
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Key dates
| Filing date | Feb 25, 2010 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Jun 16, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This disclosure describes a joint-aware deformation framework that supports the direct manipulation of an arbitrary mix of rigid and deformable components. The deformation framework may include at least a joint-analysis and a joint-aware deformation enabling a more realistic deformation of a joint-aware model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.