Patent · US Active

Laser-based three-dimensional high strain rate nanoforming techniques

US8499599B2 · kind B2 · utility

7Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 23, 2011
Grant dateAug 6, 2013
Priority date
Expiry dateFeb 16, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49806
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A laser nanoforming system and method for forming three-dimensional nanostructures from a metallic surface. A laser beam is directed to hit and explode an ablative layer to generate a shockwave that exerts a force on the metallic surface to form an inverse nanostructure of an underlying mold. A dry lubricant can be located between the metallic surface and mold to reduce friction. A confinement layer substantially transparent to the laser beam can confine the shockwave. A cushion layer can protect the mold from damage. A flyer layer between the ablative layer and metallic surface can protect the metallic surface from thermal effects of the exploding ablative layer. The mold can have feature sizes less than 500 nm. The metallic surface can be aluminum film. The dry lubricant can be sputtered Au—Cr film, evaporated Au film or a dip-coated PVP film or other dry lubricant materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.