Sputter targets and methods of forming same by rotary axial forging
US8500928B2 · kind B2 · utility
5Cited by
15References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3414
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.