Resin panels, methods, and apparatus for making resin panels
US8501069B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2010 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | May 10, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2037/0046
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process is described for making a resin panel having a grid support backing, comprising (a) applying a layer of liquid gelcoat or first resin to a surface of a mold and allowing the gelcoat or first resin to harden as a surface layer, (b) applying a layer of liquid second resin to a surface of the surface layer, (c) affixing a support grid on top of the layer of liquid second resin, (d) curing the liquid second resin at ambient temperature and pressure, so that the support grid is integral with the cured layer of resin to form a resin panel, and (e) removing the resin panel from the mold. A process is described for making a patterned resin panel, comprising (a) applying a layer of liquid resin to a surface of a mold, (b) applying a medium with the pattern printed on one side to the layer of liquid resin, with a side of the medium having the pattern being in contact with the liquid resin, (c) curing the layer of liquid resin at ambient temperature and pressure, to transfer the pattern from the medium to the layer of liquid resin, and (d) removing the medium from the cured resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.