Photosensitive element, method for formation of resist pattern, and method for production of print circuit board
US8501392B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2007 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Apr 12, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/031
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.