Radiofrequency plasma reactor and method for manufacturing vacuum process treated substrates
US8501528B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2009 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Dec 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32091
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrode (3i) of a radiofrequency parallel plate plasma reactor includes an electrode surface of a multitude of surfaces of metal members (28) which reside on dielectric spacing members (29), whereby the metal members (28) are mounted in an electrically floating manner. The dielectric members (29) are mounted, opposite to the metal members (28), upon a metal Rf supply body (14a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.