Method, device and system for measuring nanoscale deformations
US8502143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2008 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Mar 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method is provided that includes the steps of i) providing a specimen in the form of a wafer having a measurement area and a reference area, assumed to be without deformations and coplanar with the measurement area; ii) illuminating one face of the specimen with an electron beam (Fin); iii) superposing a beam (F1B) of radiation diffracted by the measurement area (B) with a beam (F1A) of the radiation diffracted by the reference so as to cause these two beams to interfere; iv) measuring the spatial periodicity and the orientation of the fringes of the interference pattern (FI); and v) deducing from this a difference in the lattice parameter and/or the orientation between the reference and measurement areas, which is indicative of a state of deformation of the latter at the nanoscale. A device and system for implementing the method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.