Method of integrating an identification circuit into a data medium
US8502677B2 · kind B2 · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2007 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Aug 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q13/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for integrating an identifier circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data. The method consists in etching in the part without data of the conductive layer, at least one resonating slot forming an antenna and coupling an integrated circuit to the slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.