Multilayer backing materials for composite armor
US8505432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Dec 5, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2571/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multilayer backing composite for armor plate systems. One embodiment provides a ceramic layer and a bonded multilayer backing layer bonded to the ceramic layer. The backing layer can be formed from at least two layers each of alternating elastomeric interstitial layers and UHMWPE layers having an areal density in the range of about 125 to 400 g/m2. The areal density of the stack can be in the range of about 4 to 15 lbs/ft2, and specifically about 6.98 lbs/ft2. In some embodiments, at least one of the at least two UHMWPE layers nearer to the ceramic layer of the stack can have a lower areal density than at least one layer further from the ceramic layer. The ceramic layer can be SiC and 0.280″ thick; each rubber layer can be about 0.01″; and each UHMWPE layer can be about 0.15″.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.