Wafer container with elasticity module
US8505732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67383
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer container, comprising: a container body, the container body having a plurality of slot portions on two opposite sidewalls of the interior of the container body for horizontally sustaining a plurality of wafers, each slot portion having a horizontal carrying portion, an opening being formed on one side of the container body for exporting and importing a plurality of wafers; and a door, said door having an inner surface and a outer surface, the inner surface being joined with the opening of the container body for protecting the plurality of wafers therein, the characteristic in that: an elasticity module is disposed on the inner wall of the rear end of the container body opposite to the opening, the elasticity module having a rectangular body and a convex portion bending toward the interior of the container body being respectively formed on two longer opposite sides of the rectangular body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.