Layered composite for a card body and method for producing the layered composite
US8505825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Sep 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24983
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The present invention relates to a layered composite (10) for producing a card body comprising a chip module (12) for a chip card, having a substrate layer arrangement (11) for arranging the chip module, and having intermediate layers (18, 19) disposed on both sides of the substrate layer arrangement, each having a cover layer (21, 22), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.