Method of making a heat exchange component using wire mesh screens
US8506242B2 · kind B2 · utility
1Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Mar 12, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49885
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchanger component is made by forming a wafer having a pair of opposed outer major faces with interstices between them from a stack of wire mesh screens. The outer major surfaces of the wafer are sealed by depositing a metal coating on them. The deposited metal coatings define between them a flow path for a heat exchange fluid extending through the interstices of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.