Implementing self-assembly nanometer-sized structures within metal—polymer interface
US8506751B2 · kind B2 · utility
3Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Sep 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.