Positive photosensitive composition
US8507171B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
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Key dates
| Filing date | Jul 13, 2010 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Jul 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a positive photosensitive composition containing a specific tetrafunctional silsesquioxane compound (A), a siloxane polymer (B) formed of multiple kinds of alkoxysilane compounds having different numbers of alkoxyl groups, a 1,2-quinone diazide compound (C), and a solvent (D) in order to provide a positive photosensitive composition useful for forming a film on which a pattern is formed, the film being excellent in high thermal resistance, high transparency, crack resistance, adhesiveness with a ground, and the like, and being obtained by performing development with an alkali aqueous solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.