Systems and methods providing semiconductor light emitters
US8507328B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2011 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Sep 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
Abstract
A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.