Lightweight wall repair compounds
US8507587B2 · kind B2 · utility
12Cited by
12References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2009 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Mar 18, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more organic ether smoothing agents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.