Profile based laser cutting within a high-speed transport device
US8507821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2009 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | May 13, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2701/1916
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present application relates to a method and system thereof for performing laser cutting on a mail piece during processing on a document processing device such as a sorter. Laser cutting is performed to effectively cut mail pieces during transport on the document processing equipment to ensure cut accuracy and to promote readability. The present teachings allow for selection of a cut profile based on mail piece attributes or markings and adaptive adjustment of the cut profile in accord with the positioning of the mail piece to achieve a desired cut pattern while the document processing device is running at high transport speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.