Optoelectronic device and method for manufacturing the same

US8507925B2 · kind B2 · utility

Assignee

• Epistar Corporation · TW

Inventors

• De-Shan Kuo · Hsinchu, TW
• Tsun-Kai Ko · Tainan, TW

Key dates

• Filing date: Dec 2, 2011
• Grant date: Aug 13, 2013
• Expiry date: Dec 13, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/879

Abstract

An optoelectronic device, comprising: a substrate; a plurality of the first semiconductor rods formed on the substrate, contacted with the substrate, and exposed partial of the first surface of the substrate; a first protection layer formed on the sidewall of the plurality of the first semiconductor rods and the exposed partial of the first surface of the substrate; a first buffer layer formed on the plurality of the first semiconductor rods wherein the first buffer layer having a first surface and a second surface opposite to the first surface, and the plurality of the first semiconductor rods directly contacted with the first surface; and at least one first hollow component formed among the first semiconductor rods, the first surface of the substrate, and the first surface of the first buffer layer and the ratio of the height and the width of the first hollow component is 1/5-3.