Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
US8508022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Oct 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.