Methods and systems for forming slots in a semiconductor substrate
US8510948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2007 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Jan 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.