Strain sensor and corresponding sensor arrangement

US8511174B2 · kind B2 · utility

Assignee

• ContiTech AG · DE

Inventors

• Wolfram Herrmann · Chemnitz, DE
• Frank Jungrichter · Medebach, DE
• Stefan Sostmann · Langenhagen, DE
• Dieter Borvitz · Hannover, DE
• Hubertus Gawinski · Lehrte, DE
• Siegfried Reck · Nienburg, DE

Key dates

• Filing date: Dec 31, 2009
• Grant date: Aug 20, 2013
• Expiry date: Oct 28, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B60C2019/004
• WIPO field: Transport
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a sensor as a built-in component of an object, especially an elastic object, the sensor comprising a polymer material containing electroconductive additives according to the invention and thereby acting as an expansion sensor (2), in that it measures the static and dynamic expansions of the object in relation to the acting forces and also monitors the changes of the polymer material generated by the static and dynamic expansions of the object over time. The invention also relates to a sensor arrangement (1) acting especially in combination with the following components: an expansion sensor (2), a fixed resistor (3), an analog/digital converter (4), a micro-controller comprising a memory (5), a radio interface (6), a controlled current/voltage source (7), an energy supply (8), a coupling coil (9), and a receiving unit (10).