Multilayered microcavities and actuators incorporating same
US8511229B2 · kind B2 · utility
Inventors
Key dates
| Filing date | May 9, 2007 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | May 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microcavity structure. In an illustrative embodiment, the microcavity structure includes a first substrate, which has a region of interest. A second substrate with a perforation therein is bonded to the first substrate. The perforation coincides with the region of interest. In a specific embodiment, the first substrate is implemented via a Printed Circuit Board (PCB). The region of interest includes one or more circuit components, including an actuator, such as a bridgewire, thereon or therein. A smoothing layer is included between the PCB and the actuator. A bonding gasket adheres the first substrate to the second substrate. The perforation accommodates energetic material that is selectively ignited via the actuator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.