Injection blow molding system with enhanced supply of heat transfer fluid to parison molds
US8512028B2 · kind B2 · utility
2Cited by
24References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Oct 15, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2049/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection blow molding (IBM) system and method for forming a plurality of parisons and molded articles. The IBM system includes an injection station having two die sets and two mold half assemblies. Each of the mold assemblies is attached to one of the die sets. The mold half assemblies are configured to cooperatively form the exterior shape of the necks of a plurality of parisons. Heat transfer channels formed in both the die sets and the mold half assemblies are fluidly connected with each other, such that a heat transfer fluid can be routed to the mold half assemblies via the die sets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.