Patent · US Active

Acrylate polyurethane chemical mechanical polishing layer

US8512427B2 · kind B2 · utility

10Cited by

6References

7Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

Jia Xie · Hubei, CN
David B. James · Newark, US
Chau Duong · Lancaster, US

Key dates

Filing date	Sep 29, 2011
Grant date	Aug 20, 2013
Priority date	—
Expiry date	Sep 29, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G18/7621
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G′, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 μm/min.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.