Sputtering apparatus
US8512530B2 · kind B2 · utility
2Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Jun 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/345
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering apparatus includes a process chamber having first and second regions, a metal target inside the process chamber, a target transfer unit inside the process chamber, the target transfer unit being configured to move the metal target between the first and second regions, a substrate holder in the second region of the process chamber, and a magnetic assembly in the first region of the process chamber, the magnetic assembly being interposed between the target transfer unit and a wall of the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.