Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method

US8512542B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Frank Heinrichsdorff · Teltow, DE
• Jens Dahl Jensen · Berlin, DE
• Hans-Richard Kretschmer · Berlin, DE
• Daniel Reznik · Berlin, DE
• Arno Steckenborn · Berlin, DE

Key dates

• Filing date: Apr 1, 2009
• Grant date: Aug 20, 2013
• Expiry date: Sep 29, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/20
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.