Injection blow molding system with enhanced heat transfer channel configuration
US8512625B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Nov 2, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/258
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection blow molding (IBM) system and method for controlling the surface temperature of the parison molds by passing heat transfer fluid through a plurality of fluidly-coupled heat transfer channels. The heat transfer channels can be formed primarily in die sets to which the parison molds are attached. The placement and distribution of the heat transfer channels relative to the parison-forming surfaces helps control the temperatures of the bodies and necks of the parisons being formed, instead of relying on various adjustments by an IBM operator. This system/method reduces the discretion required by the IBM operator and shifts the burden of consistently making high-quality parisons and molded articles onto the designer of the IBM tooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.