Method and apparatus for finishing a wood panel
US8512804B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 8, 2010 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Apr 2, 2031 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F15/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for finishing an engineered wood board. The method includes: cleaning the top and bottom, applying a first top resin layer, which contains corundum particles, to the top and a first bottom resin layer to the bottom, drying the first top and first bottom resin layers to a residual moisture content of 3% to 6%, applying a second top resin layer, which contains cellulose, to the top and a second bottom resin layer to the bottom, drying the second top and second bottom resin layers to a residual moisture content of 3% to 6%, applying an at least third top resin layer, which contains glass particles, to the top and an at least third bottom resin layer to the bottom, drying the third top and third bottom resin layers to a residual moisture content of 3% to 6%, and pressing the multilayer structure under pressure and heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.