Method for producing wiring board and wiring board
US8512856B2 · kind B2 · utility
0Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2008 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Aug 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.