Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell
US8513047B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
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Key dates
| Filing date | Nov 29, 2012 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Nov 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In accordance with the present invention, the dividing grooves 8 are formed so as not to be parallel to cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, whereby the semiconductor substrate 1 is fractured along the dividing grooves 8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.