Package-base structure of luminescent diode
US8513790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2009 |
| Grant date | Aug 20, 2013 |
| Priority date | — |
| Expiry date | Dec 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
Abstract
A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.