Patent · US Active

3D IC configuration with contactless communication

US8513795B2 · kind B2 · utility

6Cited by

10References

16Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Ping-Lin Yang · 埔鹽鄉, TW
Sa-Lly Liu · Beijing, CN
Chien-Min Lin · Taipei, TW

Key dates

Filing date	Dec 27, 2011
Grant date	Aug 20, 2013
Priority date	—
Expiry date	Dec 27, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15788
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.